Responsibility
1. According to the market trend, establish a MOS (Trench MOS, SGT MOS) chip design development plan;
2. Formulate the goals and plans of the chip design and development project, and formulate a clear project schedule;
3. According to the AE analysis, set the parameters of the MOS products to be developed;
4. Design and simulation of power semiconductor devices to ensure that the product meets the design indicators in theory;
5. Establish the process flow together with Foundry manufacturers to ensure that the product parameters, reliability and process window meet the design indicators;
6. Carry out product change and maintenance according to the requirements, and statistical analysis of experimental data;
7. Responsible for promoting the progress of the project in the group and ensuring that the project achieves the mass production target as planned;
8. Responsible for the establishment and management of the document system, rules and processes within the group.
Requirement
1. Major in semiconductor or microelectronics, master's degree (or key bachelor's degree with more than 5 years of experience);
2. Proficient in power MOS chip design and development, chip process manufacturing; At the same time, familiar with product packaging process and product application;
3. Good project and team management skills.
Please send your resume and relevant supporting documents to email ”anbon@anbonsemi.com ” ; Please indicate the subject of the email and resume as "Job Name+Name"。